Ha lits'ebetso tsa semiconductor li ntse li tsoela pele ho fihla ho 3nm, 2nm le ho feta, likamore tsa liteko tsa tikoloho li ba bohlokoa bakeng sa netefatso ea ts'epo ea ketane e felletseng, e akaretsang tlhahiso ea wafer, liphutheloana, liteko le ts'ebeliso ea qetellong. Li etsisa maemo a feteletseng ho pepesa liphoso tse patiloeng, e leng se tšehetsang nts'etsopele ea indasteri ea boleng bo holimo.
Likamore tsa Mocheso oa Motheo le Mongobo
Ha e le ea bohlokoa bakeng sa R&D le tlhahiso, li fana ka netefatso ea mantlha ea tikoloho:
- Likamore tse nang le mocheso o tlase haholo(-65°C ho isa ho 175°C, phetoho ea ±0.5°C) netefatsa botsitso ba wafer le khanyetso ea manonyeletso a solder, ho latela AEC-Q100 Kereiti ea 0.
- Likamore tsa baesekele tsa mocheso le mongoboetsa liteko tse peli tsa 85°C/85%RH (IEC 60068-2-78) ho lemoha ho qheleloa ka thoko ha sephutheloana le ho oxidation ea pin.
- Likamore tse nang le mocheso o sa feleng le mongobo(±2%RH ho nepahala) e tšehetsa tlhahiso ea wafer le ho chesoa ha eona, e fihlelang maemo a ISO 17025.
Likamore tse Ikhethileng tsa Boemo bo Holimo tse etselitsoeng lisebelisoa tsa elektroniki tsa lifofane le likoloi:
- Likamore tsa ho tšoha tse futhumatsang(-55°C ho isa ho 125°C, phetoho ea 20°C/min) e senola liphoso tse patiloeng (JESD22-A104, MIL-STD-810H).
- HAST le dikamore tse kopaneng tse tharo di potlakisa botsofali mme di kopanya ketsiso ya mocheso, mongobo le ho thothomela.
- Spray ea letsoai, likamore tse nang le khatello e tlase le tsa botsofali tsa UV li leka ho hanyetsa mafome, botsitso ba sebaka se phahameng le ho mamella maemo a leholimo.
Likamore tsa kajeno li fetohela ho nepahala ha ±0.1°C le khokahano e bohlale ea IoT, li tšehetsa lisebelisoa tse tsoetseng pele joalo ka Chiplets. Jwalo ka "bahlokomeli ba boleng", ba susumetsa indasteri ho roba litšitiso le ho hapa limmaraka tsa maemo a holimo.
Nako ea poso: Pherekhong-22-2026