Thaum cov txheej txheem semiconductor nce mus txog 3nm, 2nm thiab dhau ntawd, cov chav kuaj ib puag ncig tau dhau los ua qhov tseem ceeb rau kev txheeb xyuas kev ntseeg siab tag nrho, suav nrog kev tsim cov wafer, kev ntim khoom, kev sim thiab kev siv kawg. Lawv ua qauv qhia txog cov xwm txheej hnyav kom pom cov qhov tsis zoo, txhawb nqa kev txhim kho kev lag luam zoo.
Chav Kub thiab Av noo yooj yim
Tsis tseem ceeb rau R&D thiab kev tsim khoom, lawv xa cov ntaub ntawv pov thawj ib puag ncig tseem ceeb:
- Cov chav kub siab-qis(-65°C txog 175°C, ±0.5°C hloov pauv) xyuas kom meej tias wafer ruaj khov thiab solder sib koom ua ke tsis kam, ua raws li AEC-Q100 Qib 0.
- Cov chav ntsuas kub thiab av nooua qhov kev sim 85°C/85%RH dual 85 (IEC 60068-2-78) kom pom cov pob khoom tawg thiab cov pin oxidation.
- Cov chav kub thiab av noo tas li(± 2% RH qhov tseeb) txhawb nqa wafer fabrication thiab burn-in, ua tau raws li ISO 17025 cov qauv.
Cov Chav Tshwj Xeeb Siab Tshaj Plaws Uas Tau Tsim Rau Kev Siv Hluav Taws Xob Aerospace Thiab Automotive:
- Cov chav thermal shock(-55°C txog 125°C, 20°C/feeb hloov pauv) qhia txog qhov tsis zoo uas zais cia (JESD22-A104, MIL-STD-810H).
- HAST thiab peb lub chambers ua kom cov khoom qub sai dua thiab sib xyaw ua ke qhov kub-av noo-kev co.
- Cov tshuaj tsuag ntsev, cov chav siab qis thiab cov chav laus UV sim cov tshuaj tiv thaiv corrosion, kev ruaj khov ntawm qhov siab thiab kev nyab xeeb ntawm huab cua.
Cov chav niaj hnub no hloov zuj zus mus rau ± 0.1 ° C qhov tseeb thiab kev sib txuas IoT ntse, txhawb nqa cov khoom siv siab heev xws li Chiplets. Ua "cov neeg saib xyuas zoo", lawv tsav tsheb kev lag luam kom tawg cov teeb meem thiab ntes cov lag luam siab.
Lub sijhawm tshaj tawm: Lub Ib Hlis-22-2026